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Dicing Blade Grinding Wheel For Semiconductor And Photoelectricity Industry

    Buy cheap Dicing Blade Grinding Wheel For Semiconductor And Photoelectricity Industry from wholesalers
     
    Buy cheap Dicing Blade Grinding Wheel For Semiconductor And Photoelectricity Industry from wholesalers
    • Buy cheap Dicing Blade Grinding Wheel For Semiconductor And Photoelectricity Industry from wholesalers

    Dicing Blade Grinding Wheel For Semiconductor And Photoelectricity Industry

    Ask Lasest Price
    Price : Negotiable
    Payment Terms : T/T
    Supply Ability : 20000 pcs per month capacity
    Delivery Time : 15-20 days delivery time
    Certification : High QC standard, 100% inspection
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    Dicing Blade Grinding Wheel For Semiconductor And Photoelectricity Industry

    Metal & Resin Bond Dicing Blade

    Ultra thin dicing blades are widely used in semiconducto industry


    Features:


    • Metal bond can hold grit size strongly
    • high precision
    • good shape holding
    • good wear resistant and long using life

    Specification:


    Specifications:Application
    Common ShapeWheel SizeGrit SizeClassic SpecificationIndustryWorkpiece&MaterialMachineBondWorking Data
    1A8, 1A1ROD:10-200
    T:0.07-2.0
    H:6, 8, 12.7, 31.75,50.8
    3um-70um semiconductor industry
    optical glass industry
    optical communication
    BGA, LGA, LED
    Blue glass, crystal, gem, filter
    quartz
     Resin
    Metal
     

    Quality Dicing Blade Grinding Wheel For Semiconductor And Photoelectricity Industry for sale
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