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Vitrified & Metal Bond Grinding Wheel For Semiconductor And Photoelectricity

    Buy cheap Vitrified & Metal Bond Grinding Wheel For Semiconductor And Photoelectricity from wholesalers
     
    Buy cheap Vitrified & Metal Bond Grinding Wheel For Semiconductor And Photoelectricity from wholesalers
    • Buy cheap Vitrified & Metal Bond Grinding Wheel For Semiconductor And Photoelectricity from wholesalers

    Vitrified & Metal Bond Grinding Wheel For Semiconductor And Photoelectricity

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    Price : Negotiable
    Payment Terms : T/T
    Supply Ability : 20000 pcs per month capacity
    Delivery Time : 15-20 days delivery time
    Certification : High QC standard, 100% inspection
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    Vitrified & Metal Bond Grinding Wheel For Semiconductor And Photoelectricity

    Vitrified & Metal Bond Back Thinning Wheels​

    The back thinning is performed by a wet grind process with a rust inhibitor for cooling the chips and keeping the grind wheel free of debris. The grinding wheel acts a very important role in the grinding process, a low quality grinding wheel will lead high reject rate.


    Features:


    1. ​Good surface quality
    2. High efficiency
    3. No scratch
    4. No chipping
    5. Long using life

    Specification:


    Specifications:Application
    Common ShapeWheel SizeGrit SizeClassic SpecificationIndustryWorkpiece&MaterialMachineBondWorking Data
    6A2, 6A2T, 1A1OD: 175,195,209,305,255,355Coarse Grit: 270--800
    Finish Grit: 2000--8000
    6A2 175D 30T 76H
    6A2 200D 35T 76H
    6A2T 280D 30T 228.6H
    1A1 40D 5T 18.7H
    Semiconductor industrySapphire, silicon waferSHUWA, NTS, WEC, GALAXY. SPEEDFAM
    DISCO, OKAMOTOI, TSK, G&N, STRASBAUGH, LAMPMASTER
    Vitrified
    Metal
     
    Product Tags:

    pcd die blanks

      

    diamond bruting wheel

      
    Quality Vitrified & Metal Bond Grinding Wheel For Semiconductor And Photoelectricity for sale
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